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AT&S

AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

AT&S is a globally leading manufacturer of high-end PCBs and IC substrates. We offer interconnect solutions for applications in aerospace/aviation, and with the NADCAP accreditation, AT&S is a supplier of highest quality standards. At the AT&S Competence Center for Aerospace and Aviation in Austria, electronics experts develop high speed, high frequency solutions for space applications.

Technologies and competences

High-end technologies (center core embedding or high layer counts) allow us to provide PCBs with up to 80 layers for communication modules in satellites, launchers for space vehicles, communication and control units for ground stations. The highest standards in quality and reliability, paired with new technologies beyond industry standards ensure increased functionality and highly reliable PCBs.

Products and services in space

  • ECP® boards and modules (embedding of active and passive components)
  • High End HDI products (up to 6-n-6, up to 12 layers anylayer, …)
  • Material variety (FR4, high-TG, halogen free, HF, teflon, polyimid)
  • Multilayer PCBs: 4 – 80 layers

Space related test benches, laboratories, etc.

- Competence center for aerospace/aviation in Austria
- Technical experts in multiple regions
- Environmentally conscious production
- High mix/low volume production
- Efficient development process with lower development risk and shorter development cycles through simulation
- Emerging technology capability for embedding, high layer count
- EN-9100 & NADCAP certified quality management systems

   
Employees > 250
Turnover > 10M€
Export quota space 100 %
 
 
  Research Development Production Engineering
Spacecraft  
 
 
 
Launchers and Manned Flight  
 
 
 
Ground Segment  
 
 
 
Instruments and Payloads  
 
 
 
Satellite-based Services  
 
 
 
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AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
Fabriksgasse 13, 8700 Leoben
+43 676 8955 7885
w.brandl@ats.net
www.ats.net
Contact: Wolfgang Brandl
Last modification: 2021-03-16